MediaTek’s new Filogic chips will bring Wi-Fi 6 and Bluetooth 5.2 to next-gen IoT devices

After launching the Kompanio 900T chipset for tablets and Chromebooks in September, MediaTek is back with a couple of new products. The latest additions in MediaTek’s growing portfolio include the Filogic 130 and Filogic 130A chips that bring Wi-Fi 6 and Bluetooth 5.2 connectivity to IoT devices. In addition, MediaTek has partnered with AMD to develop the RZ600 series Wi-Fi 6E modules that feature the Filogic 330p chipset.

The new MediaTek Filogic 130 and Filogic 130A SoC integrate a microprocessor, AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit on a single chip, making them great picks for future IoT devices. Additionally, the Filogic 130A chip integrates a digital audio signal processor, allowing OEMs to add voice assistant support and other audio services to their IoT products. MediaTek claims that these new all-in-one solutions deliver energy-efficient, reliable and high-performance connectivity in small form factor designs that are ideal for IoT devices.

The Filogic 130 and Filogic 130A both support 1T1R Wi-Fi 6 connectivity, dual-band (2.4GHz and 5GHz) support, and other advanced Wi-Fi features like target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS) and WPA3 Wi-Fi security. Both chips feature an ARM Cortex-M33 microcontroller coupled with embedded RAM, external flash, and an integrated front-end module (iFEM). The additional HiFi4 DSP on the Filogic 130A offers support for more accurate far-field voice processing, always-on microphone capabilities with voice activity detection, and trigger word support.

As mentioned earlier, MediaTek has also partnered with AMD on a new Wi-Fi solution for desktops and laptops. The new AMD Rz600 series Wi-Fi 6E module consists of MediaTek’s Filogic 330P chipset. Thanks to this, the AMD RZ600 promised to deliver seamless high-speed Wi-Fi connectivity, reduced latency, and reduced interference on upcoming laptops and desktops. The Filogic 330P supports the latest connectivity standards, including 2×2 Wi-Fi 6 (2.4GHz/5GHz), Wi-Fi 6E (6GHz band up to 7.125GHz), and Bluetooth 5.2 (BT/BLE). The chipset also features MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to optimize power consumption and reduce design footprint.

The post MediaTek’s new Filogic chips will bring Wi-Fi 6 and Bluetooth 5.2 to next-gen IoT devices appeared first on xda-developers.

from xda-developers https://ift.tt/3HzVjHf
via IFTTT